Drilling and etching is an important process before electroless copper plating or direct electroplating of copper after rigid-flex printed circuit board numerical control drilling. In order to achieve reliable electrical interconnection of rigid-flex printed circuit boards, it is necessary to combine The rigid-flex printed circuit board has a special material composition, and the suitable material for drilling and etching is selected for the characteristics of the main material polyimide and acrylic acid which are not resistant to strong alkali. The rigid-flex printed circuit board is divided into two types: wet technology and dry technology. The following two technologies are discussed together with the peers.
According to this method, the rigid-flex printed circuit board after punching is drilled and etched, and then the hole is metallized. Through metallographic analysis, it is found that the inner layer is not completely penetrated, resulting in the copper layer and the hole wall. The adhesion is low. For this reason, in the metallographic analysis of the thermal stress test (288 ° C, 10 ± 1 sec), the copper layer of the hole wall falls off and the inner layer is broken.
Moreover, ammonium hydrogen fluoride or hydrofluoric acid is highly toxic, and wastewater treatment is difficult. More importantly, the polyimide is inert in concentrated sulfuric acid, so this method is not suitable for the drilling and etchback of the rigid-flex printed circuit board.
II. Chromic acid method: Because chromic acid has strong oxidizing property and strong etching ability, it can break the long chain of high molecular material in the pore wall, and oxidize and sulfonate, and generate more pro on the surface. A water-based group, such as a carbonyl group (-C=O), a hydroxyl group (-OH), a sulfonic acid group (-SO3H), etc., thereby improving the hydrophilicity, adjusting the pore wall charge, and achieving the removal of the pore wall and the concave and concave The purpose of the eclipse. The general process recipe is as follows:
Chromic anhydride CrO3 : 400 g/l
Sulfuric acid H2SO4: 350 g/l
Temperature: 50-60 ° C Time: 10-15 min
l Neutral. The oxidized substrate must be cleaned to prevent contamination of the activation solution in the subsequent process. For this purpose, a neutralization reduction process must be performed, and different neutralization reduction solutions are selected depending on the oxidation mode.
The reaction between the plasma and the glass fiber is:
So far, the plasma processing of the rigid-flexible printed circuit board has been realized.
It is noteworthy that the atomic state of O undergoes a carbonylation reaction with C-H and C=C to increase the polar group on the polymer bond, thereby improving the hydrophilicity of the surface of the polymer material.
The O2+CF4 plasma-treated rigid-flex printed circuit board, which is treated with O2 plasma, can not only improve the wettability (hydrophilicity) of the pore wall, but also remove the reaction. The sediment and the intermediate product of the incomplete reaction after the end. After the rigid-flex printed circuit board was processed by plasma technology and subjected to direct electroplating, the metallized holes were subjected to metallographic analysis and thermal stress tests, and the results were in full compliance with the GJB962A-32 standard.
In summary, whether it is dry or wet, if the appropriate method is selected for the characteristics of the main material of the system, the purpose of drilling and concave etching of the rigid-flex interconnecting mother board can be achieved.